2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007

2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007
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2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - 最新文献

Thin Film Interface Fracture Properties at Scales Relevant to Microelectronics

Pub Date : 2007-08-01 DOI: 10.1109/ICEPT.2007.4441435 A. Xiao, L.G. Wang, W. V. van Driel, O. van der Sluis, D.G. Yang, L. Ernst, G.Q. Zhang

Block-Diagram Based SIMULINK Analysis for the Drop Impact Response of a Mobile Electronic System

Pub Date : 2007-04-16 DOI: 10.1109/ESIME.2007.360063 Jiang Zhou, P. Corder, R. Niraula

A coupled numerical and experimental study on thermo-mechanical fatigue failure in SnAgCu solder joints

Pub Date : 2007-04-16 DOI: 10.1109/ESIME.2007.359928 M. Erinc, P. Schreurs, M. Geers
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