Proceedings of International Conference on Planarization/CMP Technology 2014

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Proceedings of International Conference on Planarization/CMP Technology 2014 - 最新文献

Proposal and development of a novel high-speed/high-pressure polishing machine aiming at the super high efficiency process of the hard-to-process substrates

Pub Date : 2014-11-01 DOI: 10.1109/ICPT.2014.7017296 T. Yamazaki, Toshiro Doi, Daizo Ichikawa, Kiyoshi Seshimo, Tadakazu Miyashita, Masanori Ohtsubo

Planarization of 4H-SiC(0001) by catalyst-referred etching using pure water etchant

Pub Date : 2014-11-01 DOI: 10.1109/ICPT.2014.7017297 A. Isohashi, Y. Sano, K. Yamauchi

High-k metal gate poly opening polish at 28nm technology polish rate and selective study

Pub Date : 2014-11-01 DOI: 10.1109/ICPT.2014.7017275 W. Sie, Y. L. Liu, J. Chen, W. Hong, R. P. Huang, P. Huang, Y. Li, C. -. Lin, C. H. Kung, Y. M. Lin, R. G. Lin, H. Hsu, O. Wang, J. F. Lin

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