Enabling High Aspect Ratio 3D NAND Scaling through Deposition and Etch Co-Optimization (DECO)

求助中 10 由 DQ 发布于 2026/4/16 18:29:47

DOI:10.1149/ma2022-0218869mtgabs
作者：Meihua Shen, J. Hoang, Hao Chi, Aaron Routzahn, Jonathan Church, P. Subramonium, R. Puthenkovilakam, Sirish Reddy Reddy, Sonal Bhadauriya, Sloan Roberts,&n
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IOPscience

Abstract：Over the past decade, the demands for 3D NAND flash memory devices have been increased tremendously due to ever growing digital economics in consumer electronics, data centers, IOT, healthca

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