Fabrication of diamond/copper composite thin plate based on a single-layer close packed diamond particles network for heat dissipation

已完结 10 由 seraphsunkw 发布于 2026/10/12 17:41:34

DOI:10.1016/j.cej.2023.146666
文献类型：期刊论文
补充材料：只需要正文
文献链接：https://doi.org/10.1016/j.cej.2023.146666

Elsevier

Abstract：High-efficiency heat dissipation is crucial for the reliability and durability of high-power electronics devices. Diamond/copper composites have drawn much attention as promising candidate m

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