Polyurethane-Modified Acrylic Resins: High-Adhesion and Low-Dielectric Solder Resists for Advanced Packaging

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DOI:10.1021/acsapm.6c01131
作者：Jialin Zhang, , , Chuanyu Wu, , , Jie Liu*, , , Shuye Zhang, , , Tao Wang, , , Xialei Lv, , , Jinhui Li*, , , Guoping Zhang, 
文献类型：期刊论文
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American Chemical Society (ACS)

Abstract：The advancement of integrated circuit (IC) packaging necessitates solder resist (SR) materials with exceptional adhesion, flexibility, thermal stability, and low dielectric constants. In thi

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