Mechanical–Thermal–Electrical Coupling Modeling and Temperature Rise Characteristic of a Parallel Groove Clamp With Improved Representation of Contact Interactions

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DOI:10.1109/TCPMT.2023.3263471
作者：Wenxin He;Yu Feng;Shaolei Wu;Wei Wang
文献类型：期刊论文
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Institute of Electrical and Electronics Engineers (IEEE)

Abstract：The electrical contact resistance and thermal contact resistance caused by the actual rough surfaces of parallel groove clamps exist during contact interactions, which affects the heat gener

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