Resolving Toughness‐Conductivity Conflict in Hydrogels via F‐Heat‐S Strategy for Advanced Soft Electronics

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DOI:10.1002/adfm.79337
作者：Ye Yu, Zeye Liu, Wenzhe Wei, Hong Ruan, Yunchu Shen, Xichen Hua, Xinhua Liu, Ranran Zhao, Meiwen Peng, Zhen Wen, Yuqi Li
文献类型：期刊论文
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Abstract：Polyvinyl alcohol (PVA) hydrogels hold great promise for flexible electronics, electronic skin, and soft robotics, yet simultaneously achieving high strength, toughness, and conductivity rem

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