Direct-to-Chip Two-Phase Cooling for High Heat Flux Processors

已完结 10 由 gx 发布于 2026/5/29 16:56:36

DOI:10.1115/ipack2022-97047
作者：A. Heydari, Yaman M. Manaserh, Ahmad Abubakar, Carol Caceres, Harold Miyamura, A. Ortega, Jeremy Rodriguez
文献类型：期刊论文
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American Society of Mechanical Engineers (ASME)

Abstract： Due to the surge in electronics power density, single-phase liquid cooling technologies are emerging to replace legacy air-cooling technologies. However, this surge in electronics power de

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