Thermal stress manipulated nano-crack growth for high-quality and low Kerf-loss SiC slicing via orthogonally polarized dual-beam nanosecond laser irradiation

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DOI:10.1016/j.jmatprotec.2026.119519
文献类型：期刊论文
补充材料：只需要正文
文献链接：https://doi.org/10.1016/j.jmatprotec.2026.119519

Elsevier

Abstract：High-quality laser slicing of SiC substrates with low kerf-loss remains highly challenging because nanosecond laser processing is accompanied by heat accumulation, non-uniform thermal stress

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