Mechanical response and ductile-to-brittle fracture transition of Sn-0.3Ag-0.7Cu/Cu solder joints at cryogenic temperatures

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DOI:10.1007/s10853-026-13001-6
作者：Wen Jiang,?Wenwang Wu,?Yaxin Zhu,?Changwei Wang
文献类型：期刊论文
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Springer

Abstract：The mechanical reliability of solder joints under ultra-low temperatures is of critical importance for electronic devices operating in cryogenic deep-space environments. In this work, the te

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