Thermally conductive and electrically insulative alumina/epoxy composites for advanced electronic packaging applications: A comprehensive review of filler morphologies and surface modifications

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DOI:10.1016/j.mattod.2025.03.011
作者：Zihao Lin ,?Zhijian Sun ,?Wenbin Fu ,?Yu-Chieh Lin ,?Kyoung-sik Moon ,?C.P. Wong
文献类型：期刊论文
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Elsevier

Abstract：With the rapid advancement of modern electronics, circuits are becoming more integrated and denser, supporting Moore’s Law. High density and high-power integrated circuits (ICs) generate a l

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