Dynamic imidazole-based epoxy networks for integrated latent cure and high toughness

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DOI:10.1007/s11426-025-3102-5
作者：Ziyin Wang,?Wenxuan Wu,?Zhenhan Huang,?Hua Ren,?Luping Lu,?Yi Sheng,?Yong Hu,?Jun Liang,?Qichao Xu,?Lei Yang,?Peng Xu,?Ning Zheng
文献类型：期刊论文
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Abstract：Epoxy resins are widely valued for their ease of processing and versatile applications, yet they often face a critical trade-off between extended processing windows and rapid curing kinetics

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