Topology optimization of microchannel heat sinks for non-uniform integrated chip systems

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DOI:10.1016/j.icheatmasstransfer.2025.110046
作者：Junjie Wei ,?Xujun Xu ,?Zhangchi Zhao ,?Yating Pan ,?Nanjing Hao ,?Bingxian Ou ,?Minqi Zhu ,?Yanlei Wang ,?Hongyan He ,?Zhen Li ,?Ning Wei
文献类型：期刊论文
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Elsevier

Abstract：The continuous miniaturization and integration of microelectronic devices have posed severe thermal management challenges, particularly under non-uniform heat flux distributions arising from

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