Hybrid Integration of Tunnel-Junction InGaN/GaN and Wafer-Bonded AlGaInP/GaInP for Full-Color Micro-LEDs

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DOI:10.1021/acsami.5c19943
作者：Juhyuk Park, , , Eun Jeong Youn, , , Hyun Soo Kim, , , Woo Jin Baek, , , Sang-Ah Oh, , , In Sung Cho, , , Doo Soo Kim, , , Won Tae
文献类型：期刊论文
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American Chemical Society (ACS)

Abstract：For next-generation augmented and virtual reality (AR/VR) displays, which demand extremely high pixel density and resolution, monolithic 3D (M3D) integration of RGB micro-LED pixels is regar

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