In Situ Construction of High-Thermal-Conductivity and Negative-Permittivity Epoxy/Carbon Fiber@Carbon Composites with a 3D Network by High-Temperature Chemical Vapor Deposition

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DOI:10.1021/acsami.3c15040
作者：Tao Jiang,?Kang Xu,?Ying Wang,?Lixue Xiang,?Bo Tang,?Shanshan Shi,?Yifan Li,?Wei Yu,?Huaqing Xie,?Xinfeng Wu*,?Wenge Li*,?Kai Sun,?Runhua Fan and Jinhong Yu*,?
文献类型：期刊论文
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American Chemical Society (ACS)

Abstract：Modern highly integrated microelectronic devices are unable to dissipate heat over time, which greatly affects the operating efficiency and service life of electronic equipment. Constructing

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