Improvement of solder interconnections applied on back contact solar cells with low-temperature copper paste busbars

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DOI:10.1016/j.solmat.2023.112603
作者：Dominik Rudolph ,?Tobias Messmer ,?Tudor Timofte ,?Ning Chen ,?Joris Libal ,?Florian Buchholz ,?Isaac Rosen
文献类型：期刊论文
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Elsevier

Abstract：This work addresses the solderability and the reliability of n-type IBC ZEBRA cells with screen printed copper paste busbars. Improvement of the solderability by Sn60Pb40 solder alloy coated

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