Requirements and Fundamental Technologies of the Die-bonding Film for Semiconductor Packages

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DOI:10.2324/gomu.79.393
文献类型：期刊论文
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文献链接：https://doi.org/10.2324/GOMU.79.393

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Abstract：Reaction-induced polymer alloy films are useful to the CSPs (Chip Size/Scale Package), which are suitable for compact electronic products with high calculating speed. In particular, to cope

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