Effect of Grain Thermal Expansion Mismatch on Thermal Conductivity of Porous Ceramics

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DOI:10.1111/j.1151-2916.1999.tb01865.x
文献类型：期刊论文
补充材料：只需要正文
文献链接：https://doi.org/10.1111/j.1151-2916.1999.tb01865.x

Wiley

Abstract：Many ceramics contain microcracks, which are often situated between sintered grains. These microcracks constitute thermal resistances, which may affect heat transfer through the material and

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