Deposition of Parylene C and characterization of its hermeticity for the encapsulation of MEMS and medical devices

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DOI:10.1109/NEMS.2016.7758283
作者：F. Selbmann, M. Baum, M. Wiemer, T. Gessner
文献类型：期刊论文
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Institute of Electrical and Electronics Engineers (IEEE)

Abstract：Following the recent trend of miniaturization of MEMS and the approach to improve the comfort of medical implants for patients by reducing their size the polymer Parylene is a promising cand

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