Localized electromagnetic induction heating system for rapid soldering of interfaces between integrated circuit and printed circuit board

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DOI:10.1016/j.icheatmasstransfer.2025.109001
作者：Hyeonseok Han ,?Cheolmin Kim ,?Donho Lee ,?Jeongmin Nam ,?Sunchul Kim ,?Taejae Park ,?Chaein Moon ,?Taeduk Nam ,?Bong Jae Lee ,?Inkyu Park
文献类型：期刊论文
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Elsevier

Abstract：To alleviate the challenges associated with the reflow soldering process, such as prolonged heating times and thermal damage to the devices, an electromagnetic induction heating system with

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