Ultrahigh strength, thermal stability and high thermal conductivity in hierarchical nanostructured Cu-W alloy

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DOI:10.1016/j.actamat.2023.119547
作者：J.G. Ke ,&nbsp;R. Liu ,&nbsp;Z.M. Xie ,&nbsp;L.C. Zhang ,&nbsp;X.P. Wang ,&nbsp;Q.F. Fang ,&nbsp;C.S. Liu ,&nbsp;X.B. Wu
文献类型：期刊论文
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Elsevier

Abstract：The wider application of copper alloys is challenged due to their relatively low strength and thermal stability. Here we report a nano-reinforcement dispersion strategy to achieved an excell

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