Thermal and hydraulic optimization of embedded manifold microchannel heat sink for chip cooling based on Tesla-pattern

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DOI:10.1016/j.applthermaleng.2025.128354
作者：Yi-Tao Shen, Hua Chen, Yu-Bin Dai, Qi Deng, Lin-Cheng Han, Wen-Long Cheng
文献类型：期刊论文
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Elsevier

Abstract：The embedded manifold Tesla-pattern microchannel heat sink is the key technology for AI chip cooling, requiring high thermal performance with lower power consumption. In this study, multi-ob

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