Experimental study of embedded manifold staggered pin-fin microchannel heat sink

已完结 10 由千寻仔仔发布于 2026/2/1 15:12:45

DOI:10.1016/j.ijheatmasstransfer.2024.125488
作者：Yi-Tao Shen , Yu-Hui Pan , Hua Chen, Wen-Long Cheng
文献类型：期刊论文
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Elsevier

Abstract：High-heat-flux thermal management of high-power chips in electronic devices is becoming more and more critical. Manifold microchannel heat sink is one of the effective choices. In order to i

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