Morphology-Controllable Liquid Metal/Diamond Sandwich-Structured Thermal Interface Material toward High-Efficiency Thermal Management

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DOI:10.1021/acsnano.5c03918
作者：Xingye Wang, Yandong Wang, Boren Yang, Yingying Guo, Kang Xu, Zhenbang Zhang, Rongjie Yang, Jianxiang Zhang, Boda Zhu, Yue Qin, Yiwei Zhou, Linhong Li, Maohua Li, Tao Cai, Kazuhito Nishimura, Cheng-Te
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American Chemical Society (ACS)

Abstract：With the exponential growth of AI computing power, the power density of electronic devices has exceeded 1 kW/cm2, rendering traditional thermal management materials insufficient to handle th

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