Corrigendum to “Comparative study of solder wettability on aluminum substrate and microstructure-properties of Cu-based component/aluminum laser soldering joint” [Mater. Design 215 (2022) 110485]

已完结 10 由 Pantagruel 发布于 2025/11/5 20:50:49

DOI:10.1016/j.matdes.2022.110693
作者：Peng-cheng Huan, Xiaoqi Tang, Qian Sun, Katoh Akira, Xiaoning Wang, Jie Wang, Jialong Wang, Xiajuan Wei, H. Di
文献类型：期刊论文
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Elsevier

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