Overcoming the trade-off between curing temperature and conductivity for high-performance conductive silver pastes

已完结 20 由 liuqq 发布于 2025/11/7 18:48:45

DOI:10.1007/s11706-025-0733-0
文献类型：期刊论文
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Springer

Abstract：The demand for low-temperature cured conductive silver pastes increases rapidly due to the development of advanced electronic fields, such as flexible electronics. Lowering curing temperatur

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