Damage and residual layer analysis of reactive ion etching textured multi-crystalline silicon wafer for application to solar cells

已完结 10 由小花花发布于 2025/12/2 20:06:38

DOI:10.1016/j.solener.2022.01.003
作者：Dongkyun Kang , HyunJung Park , Dongjin Choi , Hyebin Han , Jaeseung Seol , Yoonmook Kang , Hae-Seok Lee , Donghwan Kim
文献类型：期刊论文
补充材料：只需要正文

Elsevier

Abstract：As part of the surface texturing process of multi-crystalline silicon solar cells, isotropic etching is performed by using an acidic solution. Furthermore, metal catalyst chemical etching (M

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