Study on tribochemical reaction behavior induced by abrasives scratching in SiC wafer backside thinning

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DOI:10.1016/j.wear.2026.206589
作者：Qiufa Luo , Gu Li , Jieming Chen , Jing Lu , Congming Ke , Guangqiu Hu , Jianhui Zhu , Hui Huang
文献类型：期刊论文
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Elsevier

Abstract：Backside thinning of SiC wafers is a crucial process for obtaining high-performance SiC devices. However, cracks are highly prone to formation during backside thinning process, which in turn

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