MPCVD diamond thin films as heat spreaders for back end of the line (BEOL) silicon chip fabrication

已完结 10 由 seraphsunkw 发布于 2025/11/11 18:01:16

DOI:10.1016/j.diamond.2025.112999
作者：Yonhua Tzeng ,?Fu-Cheng Lin ,?Stephen Yang-En Guu ,?Yu-Sen Chien ,?Alen Jhang ,?Jian-Wei Tsai ,?Hsiaokang Chang ,?Hsin-Yen Huang ,?Shao-Kuan Lee ,?Cheng-Chin Lee ,?Kuang-Wei Yang ,?Wen-Pin Hsieh
文献类型：期刊论文
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Elsevier

Abstract：High heat dissipation is a severe challenge in modern semiconductor industry. With excellent thermal conductivity and dielectric strength, diamonds find them desirable for the thermal manage

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