Mechanical Properties and Microstructure of Cu Core Solder Ball (CCSB) Compared with SAC305 Solder for 2.5D and 3D Structure Package (PKG)

求助中 100 由 AudiLSH 发布于 2026/7/31 11:23:59

DOI:10.1166/sam.2020.3665
作者：J. Son,?Haksan Jeong,?Seulgi Lee,?Yeongwoo Lee,?Seung-Boo Jung
文献类型：期刊论文
补充材料：只需要正文

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Abstract：Package structures are continually becoming more complicated to achieve high-performance devices. Thus, the 2D structure of package needs to be modified to a 2.5D or 3D structure. Therefore,

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