The influence of multiple reflow cycles on solder joint voids for lead‐free PBGAs

已完结 20 由 TCKG 发布于 2025/8/13 16:28:42

DOI:10.1108/09540910310455707
文献类型：期刊论文
补充材料：只需要正文
文献链接：https://doi.org/10.1108/09540910310455707

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Abstract：Lead‐free soldering is becoming a common practice in the electronics industry because of the growing general opposition to lead‐containing solders. The reliability of lead‐free solders has b

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