Recent challenges, advancements, and effects of nanoparticles on the low-temperature Sn-Bi solder alloys

已完结 10 由苗玲发布于 2025/9/28 15:17:03

DOI:10.1016/j.mssp.2025.110006
作者：Ajay T. Avatare ,?Ruhan E. Ustad ,?Vijay D. Chavan ,?Zulfqar Ali Sheikh ,?Tushar P. Kamble ,?Laraib Sajjad ,?Guntak Lee ,?Sandip Sabale ,?Honggyun Kim ,?Deok-kee Kim
文献类型：期刊论文
补充材料：只需要正文

Elsevier

Abstract：There has been a notable increase in the use of solder connections within the advanced packaging industry. Recently, the application of the most used eutectic lead (Pb) based alloy has been

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