Etch and deposition co-optimization: a pathway to enabling high aspect ratio 3D NAND Flash ONON channel hole patterning

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DOI:10.1117/12.2582627
作者：Meihua Shen, J. Hoang, Chiu-Wei Hao, Danna Qian, G. Papasouliotis, Jonathan Church, P. Subramonium, E. Hudson, Leonid Belau, K. Haynes, M. Weimer, Puthenkovilakam Ragesh, Sirish K. Reddy, Sonal Bhadau
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International Society for Optics and Photonics (SPIE)

Abstract：3D NAND flash scaling relies mainly on increasing vertical stack height, thus putting challenges mostly on film deposition and etch. Among various fabrication steps, high aspect ratio (HAR)

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