A differential geometry-based method for detecting etching defects in high-density interconnect IC substrates

待确认 10 由 xlogeman 发布于 2025/1/10 17:55:20

DOI:10.1117/12.3007244
作者：Yongxing Yu, Dan Huang, Hongcheng Zhou, Yueming Hu
文献类型：期刊论文
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International Society for Optics and Photonics (SPIE)

Abstract：With the increasing precision and complexity of high-density interconnect integrated circuit (IC) substrates, automated visual inspection encounters significant challenges in accurately dete

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