Micromechanical and microstructure evolution of leaded (SnPb) and lead-free (SAC305 and SnCu) mixed solder joints during isothermal aging

已完结 10 由立秋发布于 2024/12/6 17:18:42

DOI:10.1080/01694243.2024.2356962
作者：M. Zulkifli, Izhan Abdullah, Nurul Hanis Azhan, Azman Jalar
文献类型：期刊论文
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