Effect of reflow temperature and time on the interfacial reaction of Sn-xCu/(001) Cu

已完结 10 由勿忘发布于 2025/2/27 13:11:44

DOI:10.1109/ICEPT56209.2022.9873250
作者：Xing Gao, Zhi-Jie Zhang, Q. Shi, Hong Wei, Xu Zhou
文献类型：期刊论文
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Institute of Electrical and Electronics Engineers (IEEE)

Abstract：The trend toward miniaturization of electronic products has led to the shrinking of solder micro-bumps, resulting in the number of grains in under bump metallization (UBM) continuing to decr

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