CMP Defect Reduction and Mitigation: Practices and Future Trends

已完结 10 由 bit5i54 发布于 2024/9/5 8:52:57

DOI:10.1109/ASMC51741.2021.9435652
文献类型：期刊论文
补充材料：只需要正文
文献链接：https://doi.org/10.1109/ASMC51741.2021.9435652

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Abstract：An exponential correlation is found to exist between the number of added defects on polished blanket wafers and the inverse of defect size for particulate CMP defects. Smaller surface defect

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