Effect of Ni doping on elastic properties, fracture toughness, electronic properties, and thermal conductivity of η'-Cu6Sn5 in Sn-Cu solder: A first-principles calculation

已完结 10 由勿忘发布于 2024/12/1 13:54:28

DOI:10.1016/j.mtcomm.2023.107427
作者：Shan Xu, Ancang Yang, Yonghua Duan, Mengnie Li, Mingjun Peng
文献类型：期刊论文
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Elsevier

Abstract：The phase stability, elastic properties, fracture toughness, electronic structure and thermal conductivity of Ni-doped η'-Cu6Sn5 have been obtained using first-principles calculations. Four

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