Soft electronic vias and interconnects through rapid three-dimensional assembly of liquid metal microdroplets

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DOI:10.1038/s41928-024-01268-z
作者：Dong Hae Ho, Chenhao Hu, Ling Li, Michael D. Bartlett
文献类型：期刊论文
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Nature

Abstract：The development of soft electronics requires methods to connect flexible and stretchable circuits. With conventional rigid electronics, vias are typically used to electrically connect circui

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