A study of the residual stress behavior of rigid and flexible epoxy adhesives during thermal cycle aging for electronics packaging

已完结 10 由 Hiter看世界发布于 2024/7/1 18:07:09

DOI:10.1080/01694243.2023.2240550
作者：Ruikun Wang, C. Qu, De-Cai Wang, Liwei Zhao, Xupeng Fan, Qi Sun, Sihan Liu, Lei Tan, Xianghong Cui, Shuye Zhang, Changwei Liu
文献类型：期刊论文
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