An Enhanced Interlayer Construction Strategy for High-Frequency Copper Clad Laminates: Resolving the Contradiction between Signal Loss and Adhesion

已完结 10 由坐看云起时发布于 2024/4/25 15:47:13

DOI:10.1002/admt.202301059
作者：Xiaokang Mei, Shu Yang, Jiang Lei, Qinyuan Li, Kaikai Li, Yingxi Xie, Yunpeng Yao, Longsheng Lu
文献类型：期刊论文
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Wiley

Abstract：In high-frequency printed circuit boards (PCBs), there is an inherent contradiction between minimizing signal loss and maximizing adhesion strength. To tackle this issue, this work presents

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