Origins of HDI stress in copper–brass laminates with dual-heterostructured interfaces

已完结 10 由 aaron 发布于 2026/4/9 20:13:20

DOI:https://doi.org/10.1016/j.matchar.2024.113852
文献类型：期刊论文
补充材料：只需要正文
文献链接：https://doi.org/10.1016/j.matchar.2024.113852

Elsevier

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