Heat transfer improvement in microchannel heat sink by topology design and optimization for high heat flux chip cooling

已完结 10 由 yang 发布于 2026/4/10 17:19:39

DOI:10.1016/j.ijheatmasstransfer.2018.09.092
文献类型：期刊论文
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Elsevier

Abstract：To meet the demand of ever-increasing heat flux of electronic chips, the influence of topology structure of microchannels on its heat transfer performance in chip cooling was investigated in

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