Warpage Estimation of Heterogeneous Panel-Level Fan-Out Package with Fine Line RDL and Extreme Thin Laminated Substrate Considering Molding Characteristics

已完结 10 由是好样的哈发布于 2026/4/14 9:31:32

DOI:10.1109/ECTC32696.2021.00238
作者：Chang-Chun Lee, Chi-Wei Wang, Chia-Chi Lee, Chin-Yi Chen, Yu-Hua Chen, Hung-Chih Lee, Tsun-Sheng Chou
文献类型：期刊论文
补充材料：只需要正文

Institute of Electrical and Electronics Engineers (IEEE)

Abstract：To meet the requirements of achieving high density and heterogeneous integrations, fan-out Panel level packaging (FOPLP) technology regarded as one of the promising alternative solutions has

应助信息

18小时前

灯

85ecc5b637a211f1834f34735aa3bc31.pdf 已采纳

19小时前

Book学术机器人

2026/4/14 9:31:32 未找到该文献，机器人已退出，请等待人工下载

2026/4/14 9:31:32 Book学术AI机器人收到请求，开始寻找文献

2026/4/14 9:31:32 已向机器人发送请求

19小时前

是好样的哈发布求助

上一个求助:其它数据库Naturally Fractured Carbonate Reservoir Characterization: A Case Study of a Mature High-Pour Point Oil Field in Hungary 下一个求助:其它数据库Pre-analytical phase errors constitute the vast majority of errors in clinical laboratory testing.