Preparation of high thermal conductivity shaped diamond/copper composites by isostatic pressing

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DOI:10.1016/j.matlet.2023.133894
作者：Zhijie Ye ,?Zhenhua Su ,?Kunlong Zhao ,?Xiaolei Wang ,?Wenxin Cao ,?Bing Dai ,?Ning Yan ,?Shuai Xu ,?Zhiqiang Wang ,?Jiaqi Zhu
文献类型：期刊论文
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Elsevier

Abstract：Diamond/copper composites exhibit excellent thermophysical properties and demonstrate wide potential for heat dissipation applications. However, due to high hardness, it's difficult to proce

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