以豆豉粉和摩卡芙粉为原料的饼干复合粉的理化特性和功能特性

IF 0.6 Q3 ENGINEERING, MULTIDISCIPLINARY

IIUM Engineering Journal Pub Date : 2022-07-04 DOI:10.31436/iiumej.v23i2.2234

D. Kristanti, W. Setiaboma

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引用次数: 1

摘要

消费者对不含麸质和酪蛋白的饼干产品的需求越来越大。不含麸质和酪蛋白的饼干是用mocaf代替无麸质面粉和豆豉粉作为无酪蛋白蛋白质来源制成的。由豆豉粉和摩卡粉制成的优质饼干复合粉的特性需要了解。本研究的目的是确定以豆豉粉和摩卡芬粉为原料的饼干复合粉的理化性质和功能特性。复合面粉是用干拌法混合而成的。复合面粉配方为:C0(100%小麦粉);C1 (100% mocaf);C2 (75% mocaf和25%豆豉粉);C3(50%摩卡和50%豆豉粉);C4(25%豆豉粉和75%豆豉粉)和C5(100%豆豉粉)。结果表明，豆豉粉的添加提高了豆豉的灰分、蛋白质、脂肪、矿物质、a*值、b*值和吸水能力。豆豉粉的添加被证明可以降低水分含量、碳水化合物、亮度和白度指数值。由75%的mocaf和25%的豆豉粉制成的饼干复合粉的糊化特征与100%的小麦粉相似，因此该配方被推荐为饼干复合粉。摘要:枇杷果含有谷蛋白和酪蛋白。Kuki bebas面筋和kasein, dibuat menggunakan mocaf sebagai pengganti tepung bebas面筋和tepung tempe sebagai数蛋白bebas kasein。竹节，竹节，竹节，竹节，竹节，竹节，竹节，竹节，竹节，竹节，竹节土豆泥，土豆泥，土豆泥，土豆泥，土豆泥，土豆泥，土豆泥。Tepung komposit telah dicampur dengan adunan kering。配方tepung composit ialah C0 (100% tepung gandum);C1 (100% mocaf);C2 (75% mocaf和25% tepung tempeh);C3 (50% mocaf和50% tepung tempeh);C4 (25% mocaf和75% tepong tempeh)和C5 (100% tepong tempeh)。Hasil kajian menunjukkan penambahan tepung tempeh meningkatkan kadar abu，蛋白质，lemak，矿物质，nilai a*， nilai b*， dan kapasiti penyerapan air。Penambahan tepung tempeh terbukti dapat mengurangkan kandungan lembapan, karbohidrat, ringan, dan nilai indeks keputihan。Tepung komposit biskut yang diperbuit daripada 75% mocad和25% Tepung tempe mempunyai剖面gelatisasi yang serupa dengan 100% Tepung gandum, jadi配方ini disyorkan sebagai Tepung komposit biskut。

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Physicochemical and Functional Properties of Composite Flours Based on Mocaf and Tempeh Flour for Making Cookies

Gluten and casein free cookie products are increasingly in demand by consumers. Gluten and casein free cookies were made using mocaf as a substitute for gluten-free flour and tempeh flour as a casein-free protein source. The characteristics of a good cookie composite flour made from mocaf and tempeh flour need to be known. The purpose of this study was to determine the physicochemical and functional properties of a cookie composite flour based on mocaf and tempeh flour. The composite flour was mixed by dry mixing. The composite flour formulations were: C0 (100% wheat flour); C1 (100% mocaf); C2 (75% mocaf and 25% tempeh flour); C3 (50% mocaf and 50% tempeh flour); C4 (25% mocaf and 75% tempeh flour) and C5 (100% tempeh flour). The results showed that addition of tempeh flour increased the ash, protein, fat, minerals, a* value, b* value, and water absorption capacity. The addition of tempeh flour was proven to reduce moisture content, carbohydrates, lightness, and whiteness index value. The cookie composite flour made from 75% mocaf and 25% tempeh flour had a gelatinization profile similar to 100% wheat flour, so this formula was recommended as a cookie composite flour. ABSTRAK: Produk kuki bebas gluten dan kasein semakin meningkat dalam permintaan pengguna. Kuki bebas gluten dan kasein dibuat menggunakan mocaf sebagai pengganti tepung bebas gluten dan tepung tempe sebagai sumber protein bebas kasein. Ciri-ciri tepung komposit biskut yang baik diperbuat daripada tepung mocaf dan tempeh perlu diketahui. Tujuan kajian ini adalah untuk menentukan sifat fizikokimia dan fungsian bagi tepung komposit biskut berasaskan tepung mocaf dan tempeh. Tepung komposit telah dicampur dengan adunan kering. Formulasi tepung komposit ialah C0 (100% tepung gandum); C1 (100% mocaf); C2 (75% mocaf dan 25% tepung tempeh); C3 (50% mocaf dan 50% tepung tempeh); C4 (25% mocaf dan 75% tepung tempeh) dan C5 (100% tepung tempeh). Hasil kajian menunjukkan penambahan tepung tempeh meningkatkan kadar abu, protein, lemak, mineral, nilai a*, nilai b*, dan kapasiti penyerapan air. Penambahan tepung tempeh terbukti dapat mengurangkan kandungan lembapan, karbohidrat, ringan, dan nilai indeks keputihan. Tepung komposit biskut yang diperbuat daripada 75% mocaf dan 25% tepung tempe mempunyai profil gelatinisasi yang serupa dengan 100% tepung gandum, jadi formula ini disyorkan sebagai tepung komposit biskut.

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来源期刊

IIUM Engineering Journal ENGINEERING, MULTIDISCIPLINARY-

CiteScore

2.10

自引率

20.00%

发文量

审稿时长

40 weeks

期刊介绍： The IIUM Engineering Journal, published biannually (June and December), is a peer-reviewed open-access journal of the Faculty of Engineering, International Islamic University Malaysia (IIUM). The IIUM Engineering Journal publishes original research findings as regular papers, review papers (by invitation). The Journal provides a platform for Engineers, Researchers, Academicians, and Practitioners who are highly motivated in contributing to the Engineering disciplines, and Applied Sciences. It also welcomes contributions that address solutions to the specific challenges of the developing world, and address science and technology issues from an Islamic and multidisciplinary perspective. Subject areas suitable for publication are as follows: -Chemical and Biotechnology Engineering -Civil and Environmental Engineering -Computer Science and Information Technology -Electrical, Computer, and Communications Engineering -Engineering Mathematics and Applied Science -Materials and Manufacturing Engineering -Mechanical and Aerospace Engineering -Mechatronics and Automation Engineering