固体孔隙形成机制

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference Pub Date : 2009-10-01 DOI:10.1109/IMPACT.2009.5382272

P. Wei, S. Hsiao

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引用次数: 0

摘要

在此工作中，预测了被凝固锋包围的生长或衰减气泡的形状。气泡是由于凝固前液体中溶解气体的过饱和造成的。孔隙的形成及其在固体中的形状是影响材料性能、微观结构和应力的最严重问题之一。在本研究中，利用文献中控制微小气泡形状的Young-Laplace方程的摄动解，真实地预测了固体中的气泡和孔隙形状。可以预测微泡在固体中的生长和包裹，并与实验数据相吻合。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Mechanism of pore formation in solid

The shapes of a growing or decaying bubble entrapped by a solidification front are predicted in this work. The bubble results from supersaturation of a dissolved gas in the liquid ahead of the solidification front. Pore formation and its shape in solid are one of the most serious issues affecting properties, microstructure, and stresses in materials. In this study, the bubble and pore shapes entrapped in solid are realistically predicted by utilizing perturbation solutions of Young-Laplace equation governing the tiny bubble shape in the literature. The growth and entrapment of a microbubble in solid can be predicted and found to agree with experimental data.

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来源期刊

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference

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