过冷银铜熔体中树枝晶生长迅速

S. Walder, P.L. Ryder
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引用次数: 27

摘要

65 at的Ag-Cu合金过冷熔体的反回热上升时间(Δt)−1的测量结果。% Cu的存在。结果表明(Δt)−1是生长速率的半定量度量。与对二元体系中其他成分合金的观察一致,在与T0温度相对应的过冷度处,生长率作为过冷度的函数急剧上升。当考虑到固相和液相的动力学位移时,这种行为可以用快速枝晶生长理论的框架来解释。对这种动力学效应提出了一个简单的经验表达式。对于Ag-65来说。该理论的预测用过冷时的生长率和动力学相图的形式表示。预测结果与实验结果在定性上是一致的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Rapid dendritic growth in undercooled Ag-Cu melts

The results of measurements of the reciprocal recalescence rise time (Δt)−1 of undercooled melts of an Ag-Cu alloy with 65 at.% Cu are presented. It is shown that (Δt)−1 is a semiquantitative measure of the growth rate. In agreement with observations already made on alloys with other compositions in this binary system, the growth rate as a function of the undercooling rises sharply at an undercooling corresponding to the T0 temperature. This behaviour can be explained in the framework of the theories of rapid dendritic growth, when the kinetic displacements of the solidus and liquidus are taken into account. A simple empirical expression for this kinetic effect is proposed. For the Ag-65 at.% Cu alloy the predictions of the theory are expressed as a plot of growth rate against undercooling and also in the form of a kinetic phase diagram. The predictions are in good qualitative agreement with the experimental results.

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