基于平板基底弯曲的电沉积平均应力的计算

Christo N. Kouyumdjiev
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引用次数: 15

摘要

迄今为止,以测量单面电镀造成的带材弯曲挠度为基础计算镀层平均应力的经典公式已被广泛使用。对这些公式的研究表明,它们的精度不足以满足所有的力学方程。鉴于此,本文提出了一种新的沉积层与基体相互作用的理论模型,并推导了计算平均应力的新公式。该模型既符合普遍接受的其他作者关于电沉积应力的简化假设,又能准确地满足弹性薄板理论的所有基本方程。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A calculation of average stress in electrodeposits based on the bending of a flat-plate substrate

Hitherto the classical formulae for calculation of the average stress in electrodeposits on the basis of the measured deflections of a strip bent as a result of one-sided plating have been widely used. A study of these formulae reveals that they do not show sufficient accuracy to satisfy all the equations of the mechanics. In view of this, a new theoretical model of the force interaction between the deposit and the substrate is proposed in this work and a new formula for calculating the average stress has been derived. The model conforms to the generally accepted simplifying assumptions made by other authors concerning the stress in electrodeposits, while at the same time accurately satisfying all the basic equations of the theory of thin elastic plates.

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