超细晶金属中晶粒生长增强的研究

Jianshe Lian , Ruslan Z. Valiev , Bernard Baudelet
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引用次数: 127

摘要

研究了初始晶粒尺寸为160 nm的超细晶铜的静态晶粒生长。研究表明,它的生长动力学遵循正常的晶粒生长行为,但晶粒生长始于相对较低的温度(0.32 Tm)。假设晶界扩散活化能低于粗晶材料的晶界扩散活化能,而晶界扩散活化能随晶粒长大而增大,得到了几种超细晶金属的实验数据。本文认为,这种不寻常的活化能行为是由超细晶材料中非平衡晶界的存在及其在加热过程中的恢复引起的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
On the enhanced grain growth in ultrafine grained metals

The static grain growth has been investigated in ultrafine grained copper with an initial grain size of 160 nm. It has been revealed that its kinetics follows to normal grain growth behaviour, but a grain growth starts at a relatively low temperature (0.32 Tm). Good fits with experimental data for several ultrafine grained metals have been obtained if the activation energy for grain boundary diffusion is assumed to be lower than for coarse grained materials, but increases during grain growth. It is suggested that this unusual behaviour of the activation energy is caused by the presence of non-equilibrium grain boundaries in ultrafine grained materials and their recovery during heating.

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